Investigation of the Thermal Performance of Heat Sinks with Different Fins
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Keywords:
Heat Sink, Phase Change Material (PCM), Fin Design, Computational fluid Dynamics (CFD), Energy, Heat TransfersAbstract
Operating temperature increases reduce processor efficiency, which can have a detrimental
effect on system performance. The thermal performance of heat sinks with various designs for processor
cooling were compared in this study. Using phase change materials (PCM) for cooling is a great way to
keep electronic devices from overheating. However, PCM’s low thermal conductivity limits a heat sink's
ability to transfer heat. Phase change material (PCM) was inserted into three distinct heat sink
configurations long fin (LF), short fin (SF), and original fin (OF) and analyses were conducted to determine
how these configurations affected thermal performance. In the current study, PCM (paraffine) was used to
investigate the thermal performance results of the three heat sinks at a heating power of 30 W. This allowed
for the transfer of heat between the designed heat sinks. A fluid volume model was used to track the working
fluid inside the heat sink. The phenomenon of heat transfer that occurs when solid paraffine melts was
examined. Because of the largest heat transfer area between the PCM, the results indicated that the PCM
heat sink with OF exhibited optimal thermal performance. Furthermore, the full melt time of the PCM heat
sink with OF is 20 % shorter than that with other fin shapes.
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