Innovative 3D Heterogeneous Chip Manufacturing Approach to the Problem of Approaching Physical Limits with Traditional Chip Manufacturing Technologies

Abstract

The 3D heterogeneous chip manufacturing approach is an innovative technological approach that has significant future potential. This innovative manufacturing process enables different semiconductor materials to be used in a single chip. It also offers higher performance and more functionality than traditional chips. 3D heterogeneous chip fabrication is accomplished by combining different semiconductor materials. These materials may include semiconductors with different electronic properties. While all components are made of the same semiconductor material in traditional chip manufacturing processes, a more complex and advanced structure is obtained by using different materials together in 3D heterogeneous chip production. 3D heterogeneous chip production brings many advantages thanks to the combination of different materials. Another advantage is to increase energy efficiency with 3D heterogeneous chip production. Using different materials together and in a single chip makes it possible to manage energy more efficiently. Another advantage is that the more complex and dense logic circuits of 3D heterogeneous chip fabrication can be located on the same unit square and on top of each other. In this context, this study presents the technical details and potential risks of the proposed solution method, along with end-to-end chip production, for the resolution of the mentioned problem.