Thermal and Mechanical Characterizations of Improved Polyimide Insulation for High voltage Applications
Abstract views: 52
/ 
PDF downloads: 26
Keywords:
Polyimide Insulations, Thermal stability test, Tensile Strength, TGA, UTMAbstract
Insulation failures linked to poor thermal stability and less tensile strength have drawn in power
transformers, power cables, aerospace industries and electrical and electronic circuits. The concerns have
developed regarding the thermal stability, mechanical breakdown strength and the safety of polyimide
insulations(PI) in electrical high voltage engineering. Several polyimide composites are selected for
evaluation in the laboratory tests. The selected composites of polyimides are made in the laboratory through a
roll ball milling process. Thermos-gravimetric analysis(TGA) and Tensile strength tests is performed by
using a universal testing machine (UTM) in accordance with American society for testing and materials
(ASTM D412). In this study these tests are performed in the high voltage laboratory at NUST University in
Islamabad.
Downloads
References
M. L. L. S. D. a. P. B. Rabih Khazaka, "Endurance of Thin Insulation Polyimide Films for High-Temperature Power Module Applications.," IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, Vols. VOL. 3,, p. 08, 5, MAY 2013.
P. V. N. S. S. ,. C. S. a. M. M. Ilona Plesa, "Properties of Polymer Composites Used in High-Voltage Applications REVIEW," MDPI, p. 63, 2016.
A. C. B. Ayse Sezer Hicyilmaz, "Applications of polyimide coatings: a review," SN Applied Science, p. 22, 23 February 2021.
I. H. N. John Wiley & Sons, Avoiding Static Ignition Hazards in Chemical Operations, USA: ISBN 9780470935408., 1999.
*. ,. J. A. A.-R. ,. Y. U. ,. A. A. M. ,. M.-S. H. J. H. R. a. N. A. B. SK Manirul Haque 1, "Application and Suitability of Polymeric Materials as Insulators," Energies,MDPI, no. 11 May 2021, p. 29, 2021.
N. C. A. S. B. Martin Weinberg, "POLYAMIDE ELECTRICAL INSULATION FOR USE IN LIQUID FILLED TRANSFORMERS," United States Patent Application Publication, vol. US 2017/0200555A1, Jul. 13, 2017 .
M. F. Takaaki Tanaka and Frechette, "Polymer Nanocomposites as Attractive HV Electrical Insulating Materials," in CIGRE SC A1 & D1 JOINT COLLOQUIUM, October 2007.
A. Kausar, "A review of high performance polymer nanocomposites for packaging applications in electronics and food industries," Journal of Plastic Film & Sheeting, vol. 36, no. 1, p. 19, 19 May 2019.
M. H. A. a. M. P. N. Jordan Jameson, "THERMAL DEGRADATION OF POLYIMIDE INSULATION AND ITS EFFECT ON ELECTROMAGNETIC COIL IMPEDANCE," Center for Advanced Life Cycle Engineering (CALCE).
C. I. C. a. T. L. S. Clair, "THE MECHANICAL PROPERTIES OF POLYIMIDE FILMS AFTER EXPOSURE TO HIGH pH," Plastic Film and Sheeting, vol. 08, july 1992.
A. J. Y. L. Y. L. Y. L. a. L. C. Jie Wang, "Thermal Decomposition Behavior of Polyimide Containing Flame Retardant SiO2 and Mg(OH)2," p. 10, 8 July 2022.
H. W. X. D. ,. M. X. ,. Z. W. a. X. W. Ruoqing Zhao, "Enhancing the Toughness of Free-Standing Polyimide Films for Advanced Electronics Applications," A Study on the Impact ofFilm-Forming Processes, p. 12, 27 April 2023.
J. Y. a. L. S. b. a. Q. D. He He a, "High-temperature mechanical responses of the polyimide at a high strain rate," in IOP Publishing, 2023.
S. i. C. &. B. V. U. U. Dr. Anshumala Vani, "THERMOGRAVIMETRIC ANALYISIS (TGA)".
[Online]. Available: https://designerdata.nl/materials/plastics/thermo-plastics/polyimide#google_vignette.
