A Compact Microstrip Planar Crossover for LTE Applications
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Keywords:
Microwave Integrated Circuits (MICs), Crossover, Radyo Frequency (RF), Microstrip Structures, LTE ApplicationsAbstract
Microwave integrated circuits (MICs) are becoming increasingly important in communication
systems due to their ability to efficiently transfer power and signals using crossover structures.
Conventional crossover designs, however, suffer from significant signal and power losses, limiting their
performance. In various studies, there are complex planar designs, MICs and Radio Frequency (RF) circuits
operating from frequencies and bands. This paper proposes a novel fully symmetric four-port microstrip
planar crossover that overcomes these limitations. A square microstrip structure with a size of
80.0 × 80.0 ×1.6 mm3 is presented in the design, which has a planar crossover and wide band gap at an
operating frequency of 2.1 GHz. The proposed design provides excellent isolation between ports and
minimizes signal and power losses, making it a promising solution for MICs and RF circuits for LTE
applications.
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References
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