Investigation of copper corrosion behavior in chloride bath for nickel electrodeposition


Abstract views: 124 / PDF downloads: 96

Authors

  • Amira Gharbi Mohamed Chérif Messaadia University
  • Youcef Hamlaoui Mohamed Chérif Messaadia university,

DOI:

https://doi.org/10.59287/ijanser.713

Keywords:

Nickel Coating, EIS, Cyclic Voltammetry, WLI, Grain Size

Abstract

The present study is devoted to the electrodeposition of  nickel layers on copper substrates by cyclic voltammetry from chloride bath at a scan rate of 20 mV/s and at different bath temperatures between 25 and 55 °C  and  then after to their  corrosion behavior in chloride bath. The electrochemical behavior and corrosion properties were evaluated by cyclic voltammetry, potentiodynamic and electrochemical impedance spectroscopy. While the surface analysis of nickel coating at different temperatures was conducted by optical microscopy and white light interferometer (WLI). The obtained results show that the Ni layers have been deposited successfully on the Cu substrates. It was found that raising the bath temperature to 55 °C leads to smoother, dense, compact and recovering Ni coatings with a grain size of 0.024 nm and 0.294 µm as average roughness, which is mainly due to Ni grain refinement. While the effect of increasing bath temperature leads to a decrease in the corrosion resistance of copper.

Downloads

Download data is not yet available.

Author Biographies

Amira Gharbi, Mohamed Chérif Messaadia University

Chemical engineering Department, Physics of Matter and Radiation Laboratory LPMR, Souk Ahras 41000 Algeria

Youcef Hamlaoui , Mohamed Chérif Messaadia university,

Chemical engineering Department, Physics of Matter and Radiation Laboratory LPMR, Souk Ahras 41000 Algeria

References

WAN, Ye, WANG, Xiumei, SUN, Hong, et al. Corrosion behaviour of copper at elevated temperature. Int. J. Electrochem. Sci, 2012, vol. 7, no 9, p. 7902-7914.

BALAJI, J. et SETHURAMAN, M. G. Improved corrosion resistance by forming multilayers over a copper surface by electrodeposition followed by a novel sol–gel coating method. RSC advances, 2016, vol. 6, no 98, p. 95396-95404.

TUCK, J. R., KORSUNSKY, Alexander M., DAVIDSON, R. I., et al. Modelling of the hardness of electroplated nickel coatings on copper substrates. Surface and Coatings Technology, 2000, vol. 127, no 1, p. 1-8.

SUSETYO, Ferry Budhi, FAJRAH, Musfirah Cahya, et SOEGIJONO, Bambang. Effect of electrolyte temperature on properties of nickel film coated onto copper alloy fabricated by electroplating. e-Journal of Surface Science and Nanotechnology, 2020, vol. 18, p. 223-230.

STERN, Milton et GEARY, Al L. Electrochemical polarization: I. A theoretical analysis of the shape of polarization curves. Journal of the electrochemical society, 1957, vol. 104, no 1, p. 56.

LI, Qiannan, ZHANG, Yifan, CHENG, Yulin, et al. Effect of Temperature on the Corrosion Behaviour and Corrosion Resistance of Copper–Aluminium Laminated Composite Plate. Materials, 2022, vol. 15, no 4, p. 1621.

BENTISS, Fouad, OUTIRITE, Moha, TRAISNEL, Michel, et al. Improvement of corrosion resistance of carbon steel in hydrochloric acid medium by 3, 6-bis (3-pyridyl) pyridazine. Int. J. Electrochem. Sci, 2012, vol. 7, no 2, p. 1699-1723.

SAHARI, A., AZIZI, A., SCHMERBER, G., et al. Nucleation, growth, and morphological properties of electrodeposited nickel films from different baths. Surface Review and Letters, 2008, vol. 15, no 06, p. 717-725.

FENG, Lu, REN, Yong-Yue, ZHANG, Yan-Heng, et al. Direct correlations among the grain size, texture, and indentation behaviour of nanocrystalline nickel coatings. Metals, 2019, vol. 9, no 2, p. 188.

JAMIL, Zadariana, RUIZ-TREJO, Enrique, et BRANDON, Nigel P. Nickel electrodeposition on silver for the development of solid oxide fuel cell anodes and catalytic membranes. Journal of The Electrochemical Society, 2017, vol. 164, no 4, p. D210.

DI BARI, George A. Electrodeposition of nickel. Modern electroplating, 2000, vol. 5, p. 79-114.

BOUBATRA, Mustapha, AZIZI, Amor, SCHMERBER, Guy, et al. The influence of pH electrolyte on the electrochemical deposition and properties of nickel thin films. Ionics, 2012, vol. 18, p. 425-432.WAN, Hongjun, SONG, Qiushi, SHAN, Changlu, et al. Microstructural modification of Ni electrodeposit in an acidic NiCl2 solution. Journal of Electroanalytical Chemistry, 2020, vol. 873, p. 114349.

ROUABHIA, F., HAMLAOUI, Y., MEROUFEL, Abdelkader, et al. Corrosion properties of ceria-based coating electrodeposited from alkaline bath on electrogalvanized steel. Journal of Applied Electrochemistry, 2021, vol. 51, p. 567-580.

APERADOR CHAPARRO, William Arnulfo et LOPEZ, Enrique Vera. Electrodeposition of nickel plates on copper substrates using PC y PRC. Matéria (Rio de Janeiro), 2007, vol. 12, p. 583-588.

VOSHKIN, Andrey A., ZAKHODYAEVA, Yulia A., et ZINOV’EVA, Inna V. “Green” Extractants in the Recovery Processes of Non-ferrous Metal Ions from Technological Solutions. KnE Materials Science, 2020, p. 227–238-227–238.

Downloads

Published

2023-05-18

How to Cite

Gharbi, A., & Hamlaoui , Y. (2023). Investigation of copper corrosion behavior in chloride bath for nickel electrodeposition. International Journal of Advanced Natural Sciences and Engineering Researches, 7(4), 259–264. https://doi.org/10.59287/ijanser.713

Conference Proceedings Volume

Section

Articles